Browsing by author "Derakhshandeh, Jaber"
Now showing items 21-40 of 60
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Development of wafer-level adhesive bonding for fine-pitch 3-D connections
Bertheau, Julien; Inoue, Fumihiro; Iacovo, Serena; Peng, Lan; Derakhshandeh, Jaber; Beyne, Eric (2017) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
ELD NiB for microbumps passivation and wirebonding
Derakhshandeh, Jaber; De Preter, Inge; El-Mekki, Zaid; Hou, Lin; Gerets, Carine; Dictus, Dries; Vanstreels, Kris; Croes, Kristof; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Park, Kimoon; Inoue, Fumihiro; Derakhshandeh, Jaber; Yoo, Bongyoung (2022) -
Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020) -
Electrodeposition of Indium for Low Temperature 3D Stacking
Inoue, Fumihiro; Park, Kimoon; Derakhshandeh, Jaber; Yoo, Bongyoung (2021) -
Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
Mirdamadi, S. Hossein; Derakhshandeh, Jaber; Cochet, Tom; Beyne, Eric; Beyer, Gerald; Miller, Andy; mirda (2020) -
Fine pitch rapid heat self-aligned assembly and liquid-mediated direct bonding of Si cIEMCBEhips
Dubey, Vikas; Derakhshandeh, Jaber; Beyne, Eric; Celis, Jean Pierre; De Wolf, Ingrid (2016) -
Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Inoue, Fumihiro; Derakhshandeh, Jaber; Lofrano, Melina; Beyne, Eric (2021) -
Formation, processing and characterization of Co-Sn intermetallic compounds for potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vanstreels, Kris; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Rebibis, Kenneth June; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2015) -
Fundamental study of IMC grains at low anneal temperature
Gerets, Carine; Derakhshandeh, Jaber; Shafahian, Ehsan; Cochet, Tom; La Tulipe, Douglas Charles; Beyer, Gerald; Miller, Andy; Beyne, Eric (2022) -
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Nagano, Fuya; Kajihara, Masanori; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Beyer, Gerald (2017) -
Impact of ELD layers in mechanical properties of microbumps for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; De Wolf, Ingrid (2016) -
Impact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems
De Preter, Inge; Derakhshandeh, Jaber; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings
De Preter, Inge; Derakhshandeh, Jaber; Bex, Pieter; Fodor, Ferenc; Cherman, Vladimir; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
Investigation of Co thin film as buffer layer applied to Cu/Sn eutectic bonding and UBM with Sn, SnCu, and SAC solders joints
Tang, Ya-Sheng; Derakhshandeh, Jaber; Kho, Yi-Tung; Chang, Yao-Jen; Slabbekoorn, John; De Preter, Inge; Vanstreels, Kris; Rebibis, Kenneth June; Beyne, Eric; Chen, Kuan-Neng (2017) -
IP Session on Chiplet: Design, Assembly, and Test
Vinnakota, Bapi; Derakhshandeh, Jaber; Beyne, Eric; Marinissen, Erik Jan; Chakravarty, Sreejit (2023) -
Liquid mediated direct bonding and bond propagation
Dubey, Vikas; Derakhshandeh, Jaber; O'Callaghan, John; Willems, Kherim; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid; Beyne, Eric (2016) -
Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking
Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022) -
Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack
Lofrano, Melina; Hou, Lin; Derakhshandeh, Jaber; Cherman, Vladimir; Beyne, Eric (2020)