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Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
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Authors
Mirdamadi, S. Hossein
;
Derakhshandeh, Jaber
;
Cochet, Tom
;
Beyne, Eric
;
Beyer, Gerald
;
Miller, Andy
;
mirda
DOI
10.1109/ESTC48849.2020.9229662
EISBN
978-1-7281-6293-5
ISSN
na
Conference
8th IEEE Electronics System-Integration Technology Conference (ESTC)
Journal
na
Title
Evaluation of UBM oxidation through air exposure and heating and effectiveness of wet and plasma cleaning on solder joint formation during TCB
Publication type
Proceedings paper
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2
20.500.12860/38043.2
*
2022-01-27T09:47:26Z
validation by library/open access desk
1
20.500.12860/38043
2021-11-02T16:03:16Z
*Selected version
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