Browsing by author "Hou, Lin"
Now showing items 1-20 of 27
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10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process
Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
A novel in-situ resistance measurement to extract IMC resistivity and kinetic parameter for CoSn 3D stacks
Hou, Lin; Derakhshandeh, Jaber; De Coster, Jeroen; Wang, Teng; Cherman, Vladimir; Bex, Pieter; Van De Plas, Geert; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid (2017) -
A novel intermetallic compound insertion bonding to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel intermetallic compound insertion bonding to improve throughput for sequential 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Beyne, Eric; De Wolf, Ingrid (2020) -
A novel iso-thermal intermetallic compound insertion bonding approach to improve throughput for 3D die to wafer stacking
Hou, Lin; Derakhshandeh, Jaber; Capuz, Giovanni; Lofrano, Melina; Beyne, Eric; Miller, Andy; Beyer, Gerald; De Wolf, Ingrid (2020) -
A novel resistance measurement methodology for in-situ UBM/Solder interfacial reaction monitoring
Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; De Wolf, Ingrid (2020) -
A study on IMC morphology and integration flow for low temperature and high throughput TCB down to 10 mu m pitch microbumps
Derakhshandeh, Jaber; Gerets, Carine; Inoue, Fumihiro; Capuz, Giovanni; Cherman, Vladimir; Lofrano, Melina; Hou, Lin; Cochet, Tom; De Preter, Inge; Webers, Tomas; Bex, Pieter; Jamieson, Geraldine; Maehara, Masataka; Shafahian, Ehsan; Bertheau, Julien; Beyne, Eric; La Tulipe, Douglas Charles; Beyer, Gerald; Van der Plas, Geert; Miller, Andy (2021) -
An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017) -
Die to wafer 3D stacking for below 10μm pitch microbumps
Derakhshandeh, Jaber; Hou, Lin; De Preter, Inge; Gerets, Carine; Suhard, Samuel; Dubey, Vikas; Jamieson, Geraldine; Inoue, Fumihiro; Webers, Tomas; Bex, Pieter; Capuz, Giovanni; Beyne, Eric; Slabbekoorn, John; Wang, Teng; Jourdain, Anne; Beyer, Gerald; Rebibis, Kenneth June; Miller, Andy (2016) -
ELD NiB for microbumps passivation and wirebonding
Derakhshandeh, Jaber; De Preter, Inge; El-Mekki, Zaid; Hou, Lin; Gerets, Carine; Dictus, Dries; Vanstreels, Kris; Croes, Kristof; Miller, Andy; Beyer, Gerald; Beyne, Eric (2020) -
Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
Inoue, Fumihiro; El-Mekki, Zaid; Struyf, Herbert; Hou, Lin; Derakhshandeh, Jaber; Beyne, Eric; Radisic, Alex; Hsia, Chih-Hao; Chang, Iris; Kutner, Elisabeth; Fluegel, Alexander; Arnold, Marco (2020) -
Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn
Nagano, Fuya; Kajihara, Masanori; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Beyer, Gerald (2017) -
Impact of ELD layers in mechanical properties of microbumps for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; De Wolf, Ingrid (2016) -
Mechanical and thermal investigation of a novel intermetallic insertion bonding for 3D stack
Lofrano, Melina; Hou, Lin; Derakhshandeh, Jaber; Cherman, Vladimir; Beyne, Eric (2020) -
Morphology of IMC in the binary systems of Co/Sn and Cu/Sn
Nagano, Fuya; Derakhshandeh, Jaber; Hou, Lin; Van De Peer, Myriam; De Preter, Inge; Houshmand Sharifi, Shamin; Kajihara, Masanori; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017)