Browsing by author "Rebibis, Kenneth June"
Now showing items 1-20 of 97
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3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps
Guo, Wei; Van der Plas, Geert; Ivankovic, Andrej; Eneman, Geert; Cherman, Vladimir; De Wachter, Bart; Mercha, Abdelkarim; Gonzalez, Mario; Civale, Yann; Redolfi, Augusto; Buisson, Thibault; Jourdain, Anne; Vandevelde, Bart; Rebibis, Kenneth June; De Wolf, Ingrid; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Swinnen, Bart (2012) -
3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement
Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016) -
3D stacking cobalt and nickel microbumps and kinetics of corresponding IMCs at low temperatures
De Preter, Inge; Derakhshandeh, Jaber; Nagano, Fuya; Houshmand Sharifi, Shamin; Hou, Lin; Bex, Pieter; Suhard, Samuel; Shibata, Toshiaki; Yukinori, Oda; Hashimoto, Shigeo; Lieten, Ruben; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2017) -
3D stacking of Co and Ni based microbumps
De Preter, Inge; Derakhshandeh, Jaber; Hou, Lin; Gerets, Carine; Wang, Teng; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
3D stacking using bump-less process for sub 10μm pitches
Derakhshandeh, Jaber; De Preter, Inge; Gerets, Carine; Hou, Lin; Heylen, Nancy; Beyne, Eric; Beyer, Gerald; Slabbekoorn, John; Dubey, Vikas; Jourdain, Anne; Potoms, Goedele; Inoue, Fumihiro; Jamieson, Geraldine; Vandersmissen, Kevin; Suhard, Samuel; Webers, Tomas; Capuz, Giovanni; Wang, Teng; Rebibis, Kenneth June; Miller, Andy (2016) -
3D stacking using Cu-Cu direct bonding
Hu, Yu-Hsiang; Liu, C.S.; Lii, M.J.; Rebibis, Kenneth June; Jourdain, Anne; La Manna, Antonio; Beyer, Gerald; Beyne, Eric; Yu, (2012-02) -
3D stacking using Cu-Cu direct bonding for 40μm pitch and beyond
Hu, Yu-Hsiang; Rebibis, Kenneth June; Zhao, Ming; La Manna, Antonio; Beyne, Eric; Liu, C.S.; Lii, M.J.; Yu, C.H. (2012) -
3D stacking using ultra thin dies
La Manna, Antonio; Velenis, Dimitrios; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Zhang, Wenqi; Beyne, Eric (2012) -
3D-SoC integration utilizing high accuracy wafer level bonding
Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch
Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018) -
Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
Inoue, Fumihiro; Phommahaxay, Alain; Podpod, Arnita; Suhard, Samuel; Hoshino, Hitoshi; Berthold, Moeller; Sleeckx, Erik; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric (2019) -
An alternative 3D packaging route thru wafer reconstruction
Cadacio Jr., Francisco; Wang, Teng; Salahouelhadj, Abdellah; Capuz, Giovanni; Gerets, Carine; Potoms, Goedele; Verwoerdt, Rudy; Rebibis, Kenneth June; Beyer, Gerald; Miller, Andy; Beyne, Eric; Brouwer, Erik (2015) -
An in-situ resistance measurement to extract IMC resistivity and kinetic parameter of alternative metallurgies for 3D stacking
Hou, Lin; Derakhshandeh, Jaber; Radisic, Alex; Honore, Mia; De Coster, Jeroen; Cherman, Vladimir; Bex, Pieter; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Rebibis, Kenneth June (2018) -
Bismuth-based solder characterization for lower-temperature assembly of thermally-sensitive components in 3D interconnect applications
Vakanas, George; Vandecasteele, Bjorn; De Preter, Inge; Derakhshandeh, Jaber; Snyder, Brad; Van Campenhout, Joris; Croes, Kristof; Rebibis, Kenneth June; Beyne, Eric (2014) -
Challenges and improvements for 3D-IC integration using ultra thin (25μm) devices
La Manna, Antonio; Buisson, Thibault; Detalle, Mikael; Rebibis, Kenneth June; Velenis, Dimitrios; Zhang, Wenqi; Beyne, Eric (2012-06) -
Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Gerets, Carine; Phommahaxay, Alain; Capuz, Giovanni; Duval, Fabrice; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric; Beyer, Gerald (2014) -
Characterization of extreme Si thinning proces for wafer-to-wafer stacking
Inoue, Fumihiro; Jourdain, Anne; De Vos, Joeri; Peng, Lan; Liebens, Maarten; Armini, Silvia; Uedono, Akira; Rebibis, Kenneth June; Miller, Andy; Beyne, Eric; Sleeckx, Erik (2016) -
Co-Sn intermetallic compoundsfor potential integration in 3D interconnects
Vakanas, George; O, Minho; Dimcic, Biljana; Vandecasteele, Bjorn; Vanstreels, Kris; De Messemaeker, Joke; De Preter, Inge; Derakhshandeh, Jaber; Guerrieri, Stefano; Rebibis, Kenneth June; La Manna, Antonio; Kajihara, Masanori; De Wolf, Ingrid; Beyne, Eric (2014) -
Cobalt UBM for fine pitch microbump applications in 3DIC
Derakhshandeh, Jaber; De Preter, Inge; Vandersmissen, Kevin; Dictus, Dries; Di Piazza, Luca; Hou, Lin; Guerrieri, Stefano; Vakanas, George; Armini, Silvia; Daily, Robert; Lesniewska, Alicja; Vandelaer, Yannick; Van De Peer, Myriam; Slabbekoorn, John; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2015) -
Comparing SAM (Self-Assembled Monolayer) deposition methods to passivate copper microbumps for 3D stacking
Houshmand Sharifi, Shamin; Derakhshandeh, Jaber; Armini, Silvia; De Preter, Inge; Bex, Pieter; Hou, Lin; Bartha, Johan W; Neumann, Volker; Herregods, Sebastiaan; Nagano, Fuya; Rebibis, Kenneth June; Miller, Andy; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric (2017)