Browsing by author "Duval, Fabrice"

10 and 7 mu m Pitch Thermo-compression Solder Joint, Using A Novel Solder Pillar And Metal Spacer Process

Derakhshandeh, Jaber; Capuz, Giovanni; Cherman, Vladimir; Inoue, Fumihiro; De Preter, Inge; Hou, Lin; Bex, Pieter; Gerets, Carine; Duval, Fabrice; Webers, Tomas; Bertheau, Julien; Van Huylenbroeck, Stefaan; Phommahaxay, Alain; Shafahian, Ehsan; Van der Plas, Geert; Beyne, Eric; Miller, Andy; Beyer, Gerald (2020)

3D IC assembly using thermal compression bonding and wafer-level underfill – strategies for quality improvement and throughput enhancement

Wang, Teng; Bex, Pieter; Capuz, Giovanni; Duval, Fabrice; Inoue, Fumihiro; Gerets, Carine; Bertheau, Julien; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric; Natsukawa, Masanori; Mitsukura, Kazuyuki; Hatakeyama, Keiichi (2016)

3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias

Civale, Yann; Sabuncuoglu Tezcan, Deniz; Philipsen, Harold; Duval, Fabrice; Jaenen, Patrick; Travaly, Youssef; Soussan, Philippe; Swinnen, Bart; Beyne, Eric (2011)

A capacitive humidity sensor using a positive photosensitive polymer

Pham, Nga; Cherman, Vladimir; Duval, Fabrice; Sabuncuoglu Tezcan, Deniz; Jansen, Roelof; Tilmans, Harrie (2010)

A descum review for cleaning surfaces in polymer embedded process flows

Jamieson, Geraldine; Iker, Francois; Takeshi, Kita; Duval, Fabrice; Pham, Nga; Gerets, Carine; Boullart, Werner; Funaya, T. (2010)

A new scaled through Si via with polymer fill for 3D wafer level packaging

Sabuncuoglu Tezcan, Deniz; Duval, Fabrice; Luhn, Ole; Soussan, Philippe; Swinnen, Bart (2008)

A novel fan-out concept for ultra-high chip-to-chip interconnect density with 20-μm pitch

Podpod, Arnita; Slabbekoorn, John; Phommahaxay, Alain; Duval, Fabrice; Salahouelhadj, Abdellah; Gonzalez, Mario; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2018)

A novel method for characterization of Ultra Low Viscosity NCF layers using TCB for 3D Assembly

Capuz, Giovanni; Lofrano, Melina; Gerets, Carine; Duval, Fabrice; Bex, Pieter; Derakhshandeh, Jaber; Phommahaxay, Alain; Beyne, Eric; Miller, Andy; Vanstreels, Kris (2020)

A unique temporary bond solution based on a thermoplastic material tacky at room temperature and highly thermally resistant application extension from 3D-SIC to FO-WLP

Phommahaxay, Alain; Nakamura, Atsushi; Potoms, Goedele; Bertheau, Julien; Bex, Pieter; Duval, Fabrice; Podpod, Arnita; Verbinnen, Greet; Kamochi, Yoshitaka; Sawano, Mitsuru; Beyer, Gerald; Sleeckx, Erik; Beyne, Eric (2017)

Broadband permittivity characterization of polymers up to 110GHz using co-planar waveguides

Pantano, Nicolas; Slabbekoorn, John; Duval, Fabrice; Beyne, Eric (2021)

Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside

Podpod, Arnita; Demeurisse, Caroline; Rebibis, Kenneth June; Gerets, Carine; Phommahaxay, Alain; Capuz, Giovanni; Duval, Fabrice; Sleeckx, Erik; Struyf, Herbert; Miller, Andy; Beyne, Eric; Beyer, Gerald (2014)

Chip embedding by spin-on-dielectrics

Duval, Fabrice; Soussan, Philippe; Detalle, Mikael; Beyne, Eric (2012)

Comparison of electrical properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills

Duval, Fabrice; Wang, Teng; Capuz, Giovanni; Gerets, Carine; Miller, Andy; Rebibis, Kenneth June; Beyne, Eric (2015)