Browsing by author "Duval, Fabrice"
Now showing items 21-40 of 40
-
Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
Duval, Fabrice; Soussan, Philippe; Miller, Andy; De Raedt, Walter; Sun, Xiao; Beyne, Eric; Okoro, Chukwudi (2010) -
Impact of the combination of stress buffer layer and wafer level underfill on 3D IC assembly using thermal compression bonding
Duval, Fabrice; Wang, Teng; Bex, Pieter; Lofrano, Melina; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric; Gerets, Carine (2017) -
Impact of using filtration on global and local uniformity of spin on glue materials
Bernard, Sophie; Miller, Andy; Duval, Fabrice; Pepper, V.; Braggin, J. (2011) -
Integrated magnetic cores in FOWLP and their applications
Sun, Xiao; Slabbekoorn, John; Velenis, Dimitrios; Bex, Pieter; Duval, Fabrice; Sterken, Tom; Talmelli, Giacomo; de Preter, Inge; Webers, Tomas; Adelmann, Christoph; Miller, Andy; Van der Plas, Geert; Beyne, Eric (2020) -
Mask aligner lithography simulation
Duval, Fabrice; Meliorisz, Balint; Slabbekoorn, John; Maenhoudt, Mireille; Miller, Andy; Unal, Nezih; Ritter, Daniel (2010) -
Mask aligner lithography simulation
Duval, Fabrice; Miller, Andy; Slabbekoorn, John; Maenhoudt, Mireille; Meliorisz, Balint; Ritter, Daniel; Unal, Nezih (2010) -
Novell embedded microbump approach for die-to-die and wafer-to-wafer interconnects with variable microbump diameters and down to 5 μm interconnect pitch scaling
Derakhshandeh, Jaber; Beyne, Eric; Capuz, Giovanni; Inoue, Fumihiro; Cherman, Vladimir; De Preter, Inge; Duval, Fabrice; Slabbekoorn, John; Gerets, Carine; Heyvaert, Cindy; Beirnaert, Filip; Cochet, Tom; Bex, Pieter; Hou, Lin; Lofrano, Melina; Jamieson, Geraldine; Heylen, Nancy; Suhard, Samuel; Honore, Mia; Webers, Tomas; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald (2019) -
Patterning challenges of optical waveguides for sensing applications
Jamieson, Geraldine; Baier, Ulrich; Duval, Fabrice; Verheyen, Peter; Absil, Philippe; Lepage, Guy (2012) -
Photosensitive insulation coating for a copper redistribution layer process
Matsutani, Hiroshi; Mitsukura, Kazuyuki; Makino, Tatsuya; Duval, Fabrice; Detalle, Mikael; Miller, Andy; Beyne, Eric (2014) -
Photosensitive polymer reliability for fine pitch RDL applications
Chery, Emmanuel; Duval, Fabrice; Stucchi, Michele; Slabbekoorn, John; Croes, Kristof; Beyne, Eric (2020-06) -
Polymer and bump planarization for fine pitch micro-bump stacking
Inoue, Fumihiro; Derakhshandeh, Jaber; Moeller, Berthold; Gokita, Yohei; Duval, Fabrice; Bex, Pieter; Capuz, Giovanni; Rebibis, Kenneth June; Miller, Andy; Sleeckx, Erik; Beyer, Gerald; Beyne, Eric (2018) -
Polymer deep trench filling and patterning for Through Silicon Via technology
Duval, Fabrice; Sabuncuoglu Tezcan, Deniz; Swinnen, Bart; Soussan, Philippe (2009) -
Polymer deep trench filling for Through Silicon Via technology
Duval, Fabrice; Sabuncuoglu Tezcan, Deniz; Swinnen, Bart; Soussan, Philippe (2008) -
Polymer filling of silicon trenches for 3D through silicon vias applications
Duval, Fabrice; Okoro, Chukwudi; Civale, Yann; Soussan, Philippe; Beyne, Eric (2011) -
Reliability of 3D package using wafer level underfill and low CTE epoxy mold compound materials
Cadacio Jr., Francisco; Rebibis, Kenneth June; Capuz, Giovanni; Daily, Robert; Gerets, Carine; Duval, Fabrice; Wang, Teng; Miller, Andy; Beyer, Gerald; Beyne, Eric (2014) -
Reliability Study of Polymers Used in Sub-4-mu m Pitch RDL Applications
Chery, Emmanuel; Duval, Fabrice; Stucchi, Michele; Slabbekoorn, John; Croes, Kristof; Beyne, Eric (2021) -
Scalable Through Silicon Via with polymer deep trench isolation for 3D wafer level packaging
Sabuncuoglu Tezcan, Deniz; Duval, Fabrice; Philipsen, Harold; Luhn, Ole; Soussan, Philippe; Swinnen, Bart (2009) -
Semi-additive Cu-Polymer RDL process for interposers applications
Duval, Fabrice; Detalle, Mikael; Sun, Xiao; Beyne, Eric; Roda Neve, Cesar; Velenis, Dimitrios (2014) -
The increasing role of polymers in advanced packaging – from stress buffer layers to wafer level underfills and beyond
Miller, Andy; Rebibis, Kenneth June; Duval, Fabrice; Wang, Teng; Slabbekoorn, John; De Vos, Joeri; Beyne, Eric (2016) -
Ultra-low warpage epoxy mold compound for fan-out wafer level package applications
Duval, Fabrice; Podpod, Arnita; Salahouelhadj, Abdellah; Phommahaxay, Alain; Bertheau, Julien; Rebibis, Kenneth June; Sleeckx, Erik; Beyne, Eric (2018)