dc.contributor.author | Derakhshandeh, Jaber | |
dc.contributor.author | Hou, Lin | |
dc.contributor.author | De Preter, Inge | |
dc.contributor.author | Gerets, Carine | |
dc.contributor.author | Rebibis, Kenneth June | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-27T08:44:18Z | |
dc.date.available | 2021-10-27T08:44:18Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32873 | |
dc.source | IIOimport | |
dc.title | UBM and solder metallurgy selection for fine pitch 3D stacking | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Derakhshandeh, Jaber | |
dc.contributor.imecauthor | Hou, Lin | |
dc.contributor.imecauthor | De Preter, Inge | |
dc.contributor.imecauthor | Gerets, Carine | |
dc.contributor.imecauthor | Rebibis, Kenneth June | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Derakhshandeh, Jaber::0000-0003-2448-9165 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | no | |
dc.source.beginpage | 4.34 | |
dc.source.conference | IEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019) | |
dc.source.conferencedate | 3/06/2019 | |
dc.source.conferencelocation | Brussels Belgium | |
dc.identifier.url | https://iitc-conference.org/2019-iitc-mam-program/ | |
imec.availability | Published - imec | |