dc.contributor.author | Franco, Jacopo | |
dc.contributor.author | Wu, Zhicheng | |
dc.contributor.author | Claes, Dieter | |
dc.contributor.author | Vandooren, Anne | |
dc.contributor.author | Horiguchi, Naoto | |
dc.contributor.author | Linten, Dimitri | |
dc.contributor.author | Grasser, Tibor | |
dc.contributor.author | Kaczer, Ben | |
dc.date.accessioned | 2021-10-27T09:17:55Z | |
dc.date.available | 2021-10-27T09:17:55Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32976 | |
dc.source | IIOimport | |
dc.title | On the impact of reduced thermal budget on HfO2 electron trap and SiO2 hole trap defect bands in RMG gate stacks for sequential 3D CMOS integration | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Franco, Jacopo | |
dc.contributor.imecauthor | Wu, Zhicheng | |
dc.contributor.imecauthor | Claes, Dieter | |
dc.contributor.imecauthor | Vandooren, Anne | |
dc.contributor.imecauthor | Horiguchi, Naoto | |
dc.contributor.imecauthor | Linten, Dimitri | |
dc.contributor.imecauthor | Kaczer, Ben | |
dc.contributor.orcidimec | Franco, Jacopo::0000-0002-7382-8605 | |
dc.contributor.orcidimec | Vandooren, Anne::0000-0002-2412-0176 | |
dc.contributor.orcidimec | Horiguchi, Naoto::0000-0001-5490-0416 | |
dc.contributor.orcidimec | Linten, Dimitri::0000-0001-8434-1838 | |
dc.contributor.orcidimec | Kaczer, Ben::0000-0002-1484-4007 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 7.2 | |
dc.source.conference | IEEE Semiconductor Interface Specialists Conference - SISC | |
dc.source.conferencedate | 12/12/2019 | |
dc.source.conferencelocation | San Diego, CA USA | |
dc.identifier.url | https://www.ieeesisc.org/programs/2019_SISC_technical_program.pdf | |
imec.availability | Published - imec | |