dc.contributor.author | Furuhashi, Takahisa | |
dc.contributor.author | Haneda, Masaki | |
dc.contributor.author | Sasaki, Toru | |
dc.contributor.author | Kagawa, Yoshihisa | |
dc.contributor.author | Ooka, Yutaka | |
dc.contributor.author | Hirano, Tomoyuki | |
dc.contributor.author | Ohno, Keiichi | |
dc.contributor.author | Iwamoto, Hayato | |
dc.contributor.author | Saito, Masaki | |
dc.contributor.author | Liu, Yefan | |
dc.contributor.author | Hiblot, Gaspard | |
dc.contributor.author | Vanstreels, Kris | |
dc.contributor.author | Gonzalez, Mario | |
dc.contributor.author | Velenis, Dimitrios | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | De Wolf, Ingrid | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-27T09:25:25Z | |
dc.date.available | 2021-10-27T09:25:25Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/32997 | |
dc.source | IIOimport | |
dc.title | Characterization of Impact of Vertical Stress on FinFETs | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Furuhashi, Takahisa | |
dc.contributor.imecauthor | Haneda, Masaki | |
dc.contributor.imecauthor | Sasaki, Toru | |
dc.contributor.imecauthor | Liu, Yefan | |
dc.contributor.imecauthor | Hiblot, Gaspard | |
dc.contributor.imecauthor | Vanstreels, Kris | |
dc.contributor.imecauthor | Gonzalez, Mario | |
dc.contributor.imecauthor | Velenis, Dimitrios | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | De Wolf, Ingrid | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Hiblot, Gaspard::0000-0002-3869-965X | |
dc.contributor.orcidimec | Vanstreels, Kris::0000-0002-4420-0966 | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | De Wolf, Ingrid::0000-0003-3822-5953 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.source.peerreview | yes | |
dc.source.conference | 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) | |
dc.source.conferencedate | 16/09/2019 | |
dc.source.conferencelocation | Pisa Italy | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8951822 | |
imec.availability | Published - imec | |