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Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
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Authors
Harada, Ken
;
Shibata, Toshiaki
;
Kawase, Yasuhiro
;
Teugels, Lieve
;
Heylen, Nancy
;
Struyf, Herbert
Conference
The Surface Preparation And CLeaning Conference (SPCC)
Title
Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
Publication type
Oral presentation
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