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Improvement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects

dc.contributor.authorHarada, Ken
dc.contributor.authorShibata, Toshiaki
dc.contributor.authorKawase, Yasuhiro
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorStruyf, Herbert
dc.date.accessioned2021-10-27T10:04:29Z
dc.date.available2021-10-27T10:04:29Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33099
dc.sourceIIOimport
dc.titleImprovement in post-Chemical Mechanical Planarization cleaning process for Ru interconnects
dc.typeOral presentation
dc.contributor.imecauthorHarada, Ken
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.source.peerreviewno
dc.source.conferenceThe Surface Preparation And CLeaning Conference (SPCC)
dc.source.conferencedate2/04/2019
dc.source.conferencelocationPortland, OR USA
dc.identifier.urlhttps://www.linx-consulting.com/wp-content/uploads/2019/04/SPCC-2019-Proceedings-Binder.pdf
imec.availabilityPublished - imec


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