Protective layer for collective die to wafer hybrid bonding

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Authors
Inoue, Fumihiro; Bertheau, Julien; Suhard, Samuel; Phommahaxay, Alain; Ohashi, Takuya; Kinoshita, Tetsuro; Kinoshita, Yohei; Beyne, Eric
Conference
International 3D Systems Integration Conference - 3DIC 2019
Title
Protective layer for collective die to wafer hybrid bonding
Publication type
Proceedings paper
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