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Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPodpod, Arnita
dc.contributor.authorSuhard, Samuel
dc.contributor.authorHoshino, Hitoshi
dc.contributor.authorBerthold, Moeller
dc.contributor.authorSleeckx, Erik
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T10:45:18Z
dc.date.available2021-10-27T10:45:18Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33197
dc.sourceIIOimport
dc.titleAdvanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bonding
dc.typeProceedings paper
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorSuhard, Samuel
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage437
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2018
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811039
imec.availabilityPublished - open access


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