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Impact of plasma density and pattern aspect ratio on plasma damage in deep submicron CMOS technologies

dc.contributor.authorCreusen, Martin
dc.contributor.authorVan den bosch, G.
dc.contributor.authorvan der Groen, Sonja
dc.contributor.authorGroeseneken, Guido
dc.contributor.authorAckaert, J.
dc.contributor.authorDe Backer, E.
dc.date.accessioned2021-10-06T10:50:50Z
dc.date.available2021-10-06T10:50:50Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3321
dc.sourceIIOimport
dc.titleImpact of plasma density and pattern aspect ratio on plasma damage in deep submicron CMOS technologies
dc.typeProceedings paper
dc.contributor.imecauthorGroeseneken, Guido
dc.source.peerreviewno
dc.source.beginpage164
dc.source.endpage167
dc.source.conferenceESSDERC'99 - Proceedings of the 29th European Solid-State Device Research Conference; 13-15 September 1999; Leuven, Belgium.
imec.availabilityPublished - imec


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