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Development of Metal Free Wet Etching Chemical for Ruthenium Interconnect

dc.contributor.authorKesters, Els
dc.contributor.authorOhashi, Takuya
dc.contributor.authorWada, Y
dc.contributor.authorSugawara, M
dc.contributor.authorKumagai, T
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorRip, Jens
dc.contributor.authorOniki, Yusuke
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-27T11:16:59Z
dc.date.available2021-10-27T11:16:59Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33269
dc.sourceIIOimport
dc.titleDevelopment of Metal Free Wet Etching Chemical for Ruthenium Interconnect
dc.typeMeeting abstract
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorOhashi, Takuya
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorRip, Jens
dc.contributor.imecauthorOniki, Yusuke
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecOniki, Yusuke::0000-0002-6619-1327
dc.source.peerreviewno
dc.source.conferenceThe Surface Preparation and Cleaning Conference (SPCC) 2019
dc.source.conferencedate1/04/2019
dc.source.conferencelocationPortland, OR USA
imec.availabilityPublished - imec


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