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Junction technology challenges and solutions for 3D device architecture

dc.contributor.authorKikuchi, Yoshiaki
dc.contributor.authorMertens, Hans
dc.contributor.authorRitzenthaler, Romain
dc.contributor.authorChiarella, Thomas
dc.contributor.authorPeter, Antony
dc.contributor.authorHoriguchi, Naoto
dc.date.accessioned2021-10-27T11:29:10Z
dc.date.available2021-10-27T11:29:10Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33296
dc.sourceIIOimport
dc.titleJunction technology challenges and solutions for 3D device architecture
dc.typeProceedings paper
dc.contributor.imecauthorKikuchi, Yoshiaki
dc.contributor.imecauthorMertens, Hans
dc.contributor.imecauthorRitzenthaler, Romain
dc.contributor.imecauthorChiarella, Thomas
dc.contributor.imecauthorPeter, Antony
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecRitzenthaler, Romain::0000-0002-8615-3272
dc.contributor.orcidimecChiarella, Thomas::0000-0002-6155-9030
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.source.peerreviewyes
dc.source.conference19th International Workshop on Junction Technology - IWJT
dc.source.conferencedate6/06/2019
dc.source.conferencelocationKyoto Japan
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8802891
imec.availabilityPublished - imec


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