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Application of surface and interface characterization of materials in back-end-of-line interconnect

dc.contributor.authorLe, Quoc Toan
dc.contributor.authorKesters, Els
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorHolsteyns, Frank
dc.date.accessioned2021-10-27T12:12:04Z
dc.date.available2021-10-27T12:12:04Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33385
dc.sourceIIOimport
dc.titleApplication of surface and interface characterization of materials in back-end-of-line interconnect
dc.typeMeeting abstract
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.source.peerreviewno
dc.source.conference7th International Workshop on Nanotechnology and Application - IWNA 2019
dc.source.conferencedate6/11/2019
dc.source.conferencelocationPhan Thiet Vietman
imec.availabilityPublished - imec


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