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Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Publication:
Beyond BEOL interconnect wafer level monolithic near-infrared/infrared thin film photo diode image sensor integration
Date
2019
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Li, Yunlong
;
Cheyns, David
;
Moreno Hagelsieb, Luis
;
Georgitzikis, Epimitheas
;
Lim, Myung jin
;
Mao, Ming
;
Witters, Thomas
;
Leyssens, Kenny
;
Boulenc, Pierre
;
Lee, Jiwon
;
Malinowski, Pawel
;
Guerrieri, Stefano
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Abstract
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2272
since deposited on 2021-10-27
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Acq. date: 2025-10-29
Citations
Metrics
Views
2272
since deposited on 2021-10-27
5
last week
Acq. date: 2025-10-29
Citations