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What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging

dc.contributor.authorLiebens, Maarten
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorYeoh, Richard
dc.contributor.authorKrah, T.
dc.contributor.authorVangal, A.
dc.contributor.authorHiebert, S.
dc.contributor.authorCross, A.
dc.date.accessioned2021-10-27T12:44:06Z
dc.date.available2021-10-27T12:44:06Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33449
dc.sourceIIOimport
dc.titleWhat's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging
dc.typeMeeting abstract
dc.contributor.imecauthorLiebens, Maarten
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.conference2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
dc.source.conferencedate6/05/2019
dc.source.conferencelocationSaratoga, NY USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8791791
imec.availabilityPublished - imec


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