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dc.contributor.authorLiu, Yefan
dc.contributor.authorYu, Hao
dc.contributor.authorHiblot, Gaspard
dc.contributor.authorKruv, Anastasiia
dc.contributor.authorSchaekers, Marc
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-27T12:50:57Z
dc.date.available2021-10-27T12:50:57Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33462
dc.sourceIIOimport
dc.titleStudy of the mechanical stress impact on silicide contact resistance by 4-point bending
dc.typeProceedings paper
dc.contributor.imecauthorLiu, Yefan
dc.contributor.imecauthorYu, Hao
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorSchaekers, Marc
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecYu, Hao::0000-0002-1976-0259
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecSchaekers, Marc::0000-0002-1496-7816
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage5
dc.source.conference2019 IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedate31/03/2019
dc.source.conferencelocationMonterey, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8720416
imec.availabilityPublished - open access


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