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Roughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions

dc.contributor.authorLorusso, Gian
dc.contributor.authorRispens, Gijsbert
dc.contributor.authorRutigliani, Vito
dc.contributor.authorVan Roey, Frieda
dc.contributor.authorFrommhold, Andreas
dc.contributor.authorSchiffelers, Guido
dc.date.accessioned2021-10-27T12:59:28Z
dc.date.available2021-10-27T12:59:28Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33478
dc.sourceIIOimport
dc.titleRoughness decomposition: an on-wafer methodology to discriminate mask, metrology, and shot noise contributions
dc.typeMeeting abstract
dc.contributor.imecauthorLorusso, Gian
dc.contributor.imecauthorRispens, Gijsbert
dc.contributor.imecauthorVan Roey, Frieda
dc.contributor.imecauthorFrommhold, Andreas
dc.contributor.imecauthorSchiffelers, Guido
dc.contributor.orcidimecFrommhold, Andreas::0000-0001-6824-5643
dc.source.peerreviewyes
dc.source.beginpage109590T
dc.source.conferenceMetrology, Inspection, and Process Control for Microlithography XXXIII
dc.source.conferencedate24/02/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2515175
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 10959


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