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Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging

dc.contributor.authorMalainou, Antonia
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2021-10-27T13:20:55Z
dc.date.available2021-10-27T13:20:55Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33518
dc.sourceIIOimport
dc.titleDevelopment of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging
dc.typeProceedings paper
dc.contributor.imecauthorMalainou, Antonia
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.source.peerreviewyes
dc.source.conferenceEPTC 2019
dc.source.conferencedate4/12/2019
dc.source.conferencelocationSingapore Singapore
imec.availabilityPublished - imec


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