Publication:
Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging
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1867 since deposited on 2021-10-27
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Acq. date: 2026-02-26
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Statistics
Views
1867 since deposited on 2021-10-27
1last month
1last week
Acq. date: 2026-02-26
Citations