Publication:
Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging
Date
| dc.contributor.author | Malainou, Antonia | |
| dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.imecauthor | Malainou, Antonia | |
| dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
| dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
| dc.date.accessioned | 2021-10-27T13:20:55Z | |
| dc.date.available | 2021-10-27T13:20:55Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33518 | |
| dc.source.conference | EPTC 2019 | |
| dc.source.conferencedate | 4/12/2019 | |
| dc.source.conferencelocation | Singapore Singapore | |
| dc.title | Development of copper/dielectric hybrid fusion bonding with cavity for CMOS compatible wafer level hermetic packaging | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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