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The impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay

dc.contributor.authorMouraille, Orion
dc.contributor.authorvan Haren, Richard
dc.contributor.authorSteinert, Steffen
dc.contributor.authorD'have, Koen
dc.contributor.authorVan Dijk, Leon
dc.contributor.authorHermans, Jan
dc.contributor.authorBeyer, Dirk
dc.date.accessioned2021-10-27T14:23:38Z
dc.date.available2021-10-27T14:23:38Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33629
dc.sourceIIOimport
dc.titleThe impact of the reticle and wafer alignment mark placement accuracy on the intra-field mask-to-mask overlay
dc.typeOral presentation
dc.contributor.imecauthorvan Haren, Richard
dc.contributor.imecauthorD'have, Koen
dc.contributor.imecauthorHermans, Jan
dc.contributor.orcidimecD'have, Koen::0000-0002-5195-9241
dc.contributor.orcidimecHermans, Jan::0000-0003-1249-8902
dc.source.peerreviewno
dc.source.conferenceASML Technology Conference 2019 's Hertogenbosch
dc.source.conferencedate20/06/2019
dc.source.conferencelocation's Hertogenbosch The Netherlands
imec.availabilityPublished - imec


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