Publication:
FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers
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2048 since deposited on 2021-10-27
3last month
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Acq. date: 2026-04-07
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Statistics
Views
2048 since deposited on 2021-10-27
3last month
2last week
Acq. date: 2026-04-07
Citations