Publication:
FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers
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2056 since deposited on 2021-10-27
6last month
1last week
Acq. date: 2026-05-19
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Statistics
Views
2056 since deposited on 2021-10-27
6last month
1last week
Acq. date: 2026-05-19
Citations