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FITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers

dc.contributor.authorOp de Beeck, Maaike
dc.contributor.authorVerplancke, Rik
dc.contributor.authorSchaubroeck, David
dc.contributor.authorLi, Changzheng
dc.contributor.authorCuypers, Dieter
dc.contributor.authorCauwe, Maarten
dc.contributor.authorVandecasteele, Bjorn
dc.contributor.authorMader, Lothar
dc.contributor.authorVanhaverbeke, Celine
dc.contributor.authorO'Callaghan, John
dc.contributor.authorBraeken, Dries
dc.contributor.authorAndrei, Alexandru
dc.contributor.authorFirrincieli, Andrea
dc.contributor.authorBallini, Marco
dc.contributor.authorKundu, Aritra
dc.contributor.authorFahmy, Ahmed
dc.contributor.authorPatrick, Erin
dc.contributor.authorMaghari, Nima
dc.contributor.authorBashirullah, Rizwan
dc.contributor.authorDe Baets, Johan
dc.date.accessioned2021-10-27T15:07:34Z
dc.date.available2021-10-27T15:07:34Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33704
dc.sourceIIOimport
dc.titleFITEP: a flexible implantable thin electronic package platform for long tem implatation applications, based on polymer and ceramic ALD multilayers
dc.typeProceedings paper
dc.contributor.imecauthorOp de Beeck, Maaike
dc.contributor.imecauthorVerplancke, Rik
dc.contributor.imecauthorSchaubroeck, David
dc.contributor.imecauthorLi, Changzheng
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorVandecasteele, Bjorn
dc.contributor.imecauthorMader, Lothar
dc.contributor.imecauthorO'Callaghan, John
dc.contributor.imecauthorBraeken, Dries
dc.contributor.imecauthorAndrei, Alexandru
dc.contributor.imecauthorFirrincieli, Andrea
dc.contributor.imecauthorBallini, Marco
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecOp de Beeck, Maaike::0000-0002-2700-6432
dc.contributor.orcidimecVerplancke, Rik::0000-0002-6642-9454
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.source.peerreviewyes
dc.source.conference2019 Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics
dc.source.conferencedate22/01/2019
dc.source.conferencelocationSan Diego, CA USA
dc.identifier.urlhttp://www.imaps.org/abstracts/system/new/abstract_preview.asp?abstract=2019medical008
imec.availabilityPublished - imec


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