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Pre-bonding characterization of SiCN enabled wafer stacking

dc.contributor.authorPeng, Lan
dc.contributor.authorKim, Soon-Wook
dc.contributor.authorIacovo, Serena
dc.contributor.authorInoue, Fumihiro
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T15:46:17Z
dc.date.available2021-10-27T15:46:17Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33769
dc.sourceIIOimport
dc.titlePre-bonding characterization of SiCN enabled wafer stacking
dc.typeProceedings paper
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorKim, Soon-Wook
dc.contributor.imecauthorIacovo, Serena
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecIacovo, Serena::0000-0002-0826-9165
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage14
dc.source.conference2019 6th International Workshop on Low Temperature Bonding for 3D Integration LTB-3D 2019
dc.source.conferencedate21/05/2019
dc.source.conferencelocationKanazawa Japan
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8735126
imec.availabilityPublished - open access


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