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The growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics

dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorGuerrero, Alice
dc.contributor.authorKennes, Koen
dc.contributor.authorPodpod, Arnita
dc.contributor.authorBrems, Steven
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorTussing, Sebastian
dc.contributor.authorSpiess, Walter
dc.contributor.authorPenger, Luke
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.contributor.authorRapps, Thomas
dc.contributor.authorLutter, Stefan
dc.contributor.authorSleeckx, Erik
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorAsselberghs, Inge
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRadu, Iuliana
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T16:02:36Z
dc.date.available2021-10-27T16:02:36Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33795
dc.sourceIIOimport
dc.titleThe growing applilcation field of laser debonding: from advanced packaging to future nanoelectronics
dc.typeProceedings paper
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorBrems, Steven
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorAsselberghs, Inge
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBrems, Steven::0000-0002-0282-8528
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference2019 International Wafer Level Packaging Conference (IWLPC)
dc.source.conferencedate13/10/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8914124
imec.availabilityPublished - open access


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