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Novel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift

dc.contributor.authorPodpod, Arnita
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBex, Pieter
dc.contributor.authorKennes, Koen
dc.contributor.authorBertheau, Julien
dc.contributor.authorArumugam, Hariharan
dc.contributor.authorCochet, Tom
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T16:13:13Z
dc.date.available2021-10-27T16:13:13Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33812
dc.sourceIIOimport
dc.titleNovel temporary bonding and debonding solutions enabling an ultrahigh interconnect density FO-WLP structure assembly with quasi-zero die shift
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorKennes, Koen
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorArumugam, Hariharan
dc.contributor.imecauthorCochet, Tom
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conference2019 International Wafer Level Packaging Conference (IWLPC)
dc.source.conferencedate22/10/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8914144
imec.availabilityPublished - open access


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