dc.contributor.author | Podpod, Arnita | |
dc.contributor.author | Phommahaxay, Alain | |
dc.contributor.author | Bex, Pieter | |
dc.contributor.author | Slabbekoorn, John | |
dc.contributor.author | Bertheau, Julien | |
dc.contributor.author | Salahouelhadj, Abdellah | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Miller, Andy | |
dc.contributor.author | Beyer, Gerald | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Guerrero, Alice | |
dc.contributor.author | Yess, Kim | |
dc.contributor.author | Arnold, Kim | |
dc.date.accessioned | 2021-10-27T16:13:58Z | |
dc.date.available | 2021-10-27T16:13:58Z | |
dc.date.issued | 2019 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33813 | |
dc.source | IIOimport | |
dc.title | Advances in temporary carrier technology for high density fan-out device build-up | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Podpod, Arnita | |
dc.contributor.imecauthor | Phommahaxay, Alain | |
dc.contributor.imecauthor | Bex, Pieter | |
dc.contributor.imecauthor | Slabbekoorn, John | |
dc.contributor.imecauthor | Bertheau, Julien | |
dc.contributor.imecauthor | Salahouelhadj, Abdellah | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Miller, Andy | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Guerrero, Alice | |
dc.contributor.orcidimec | Bex, Pieter::0000-0003-0896-2514 | |
dc.contributor.orcidimec | Salahouelhadj, Abdellah::0000-0002-3795-1446 | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 340 | |
dc.source.endpage | 345 | |
dc.source.conference | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) | |
dc.source.conferencedate | 28/05/2019 | |
dc.source.conferencelocation | Las Vegas USA | |
dc.identifier.url | https://ieeexplore.ieee.org/document/8811142 | |
imec.availability | Published - open access | |