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dc.contributor.authorPodpod, Arnita
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBex, Pieter
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorBertheau, Julien
dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorSleeckx, Erik
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.authorGuerrero, Alice
dc.contributor.authorYess, Kim
dc.contributor.authorArnold, Kim
dc.date.accessioned2021-10-27T16:13:58Z
dc.date.available2021-10-27T16:13:58Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33813
dc.sourceIIOimport
dc.titleAdvances in temporary carrier technology for high density fan-out device build-up
dc.typeProceedings paper
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorBertheau, Julien
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorGuerrero, Alice
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage340
dc.source.endpage345
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811142
imec.availabilityPublished - open access


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