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dc.contributor.authorPrasad, D.
dc.contributor.authorNibhanupudi, S.
dc.contributor.authorDas, S.
dc.contributor.authorZografos, Odysseas
dc.contributor.authorChehab, Bilal
dc.contributor.authorSarkar, Satadru
dc.contributor.authorBaert, Rogier
dc.contributor.authorRobinson, A.
dc.contributor.authorGupta, Anshul
dc.contributor.authorSpessot, Alessio
dc.contributor.authorDebacker, Peter
dc.contributor.authorVerkest, Diederik
dc.contributor.authorKulkarni, J.
dc.contributor.authorCline, B.
dc.contributor.authorSinha, S.
dc.date.accessioned2021-10-27T16:20:08Z
dc.date.available2021-10-27T16:20:08Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33822
dc.sourceIIOimport
dc.titleBuried power rails and back-side power grids: ARM CPU power delivery network design beyond 5nm
dc.typeProceedings paper
dc.contributor.imecauthorZografos, Odysseas
dc.contributor.imecauthorChehab, Bilal
dc.contributor.imecauthorSarkar, Satadru
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.orcidimecZografos, Odysseas::0000-0002-9998-8009
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage446
dc.source.endpage449
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM 2019
dc.source.conferencedate9/12/2019
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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