Show simple item record

Extending the roadmap beyond 3nm through system scaling boosters: A case study on buried power rail and backside power delivery

dc.contributor.authorRyckaert, Julien
dc.contributor.authorGupta, Anshul
dc.contributor.authorJourdain, Anne
dc.contributor.authorChava, Bharani
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorVerkest, Diederik
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T17:21:34Z
dc.date.available2021-10-27T17:21:34Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33917
dc.sourceIIOimport
dc.titleExtending the roadmap beyond 3nm through system scaling boosters: A case study on buried power rail and backside power delivery
dc.typeProceedings paper
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVerkest, Diederik
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecVerkest, Diederik::0000-0001-6567-2746
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage50
dc.source.conference2019 Electron Devices Technology and Manufacturing Conference (EDTM)
dc.source.conferencedate12/03/2019
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8731234
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
45423.pdf
Size:
312.7Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record