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Study of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation

dc.contributor.authorSalahouelhadj, Abdellah
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVanstreels, Kris
dc.contributor.authorPodpod, Arnita
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T17:28:03Z
dc.date.available2021-10-27T17:28:03Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33927
dc.sourceIIOimport
dc.titleStudy of wafer warpage for Fan-Out wafer level packaging: finite element modelling and experimental validation
dc.typeProceedings paper
dc.contributor.imecauthorSalahouelhadj, Abdellah
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorPodpod, Arnita
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSalahouelhadj, Abdellah::0000-0002-3795-1446
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage7
dc.source.conference20th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
dc.source.conferencedate24/03/2019
dc.source.conferencelocationHannover Germany
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8724578
imec.availabilityPublished - open access


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