Show simple item record

3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI

dc.contributor.authorSirbu, B.
dc.contributor.authorEichhammer, Y.
dc.contributor.authorOppermann, H.
dc.contributor.authorTekin, T.
dc.contributor.authorKraft, J.
dc.contributor.authorSidorov, V.
dc.contributor.authorYin, Xin
dc.contributor.authorBauwelinck, Johan
dc.contributor.authorNeumeyr, C.
dc.contributor.authorSoares, F.
dc.date.accessioned2021-10-27T18:29:37Z
dc.date.available2021-10-27T18:29:37Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34020
dc.sourceIIOimport
dc.title3D silicon photonics interposer for Tb/s optical interconnects in data centers with double-side assembled active components and integrated optical and electrical through silicon via on SOI
dc.typeProceedings paper
dc.contributor.imecauthorYin, Xin
dc.contributor.imecauthorBauwelinck, Johan
dc.contributor.orcidimecYin, Xin::0000-0002-9672-6652
dc.contributor.orcidimecBauwelinck, Johan::0000-0001-5254-2408
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1052
dc.source.endpage1059
dc.source.conferenceIEEE 69th Electronic Components and Technology Conference - ECTC
dc.source.conferencedate25/05/2019
dc.source.conferencelocationLas Vegas USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811251
imec.availabilityPublished - open access


Files in this item

Thumbnail
Name:
44913.pdf
Size:
564.0Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record