Publication:
RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology
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1882 since deposited on 2021-10-27
1last month
Acq. date: 2026-03-18
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Statistics
Views
1882 since deposited on 2021-10-27
1last month
Acq. date: 2026-03-18
Citations