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RF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology

dc.contributor.authorSun, Xiao
dc.contributor.authorSlabbekoorn, John
dc.contributor.authorVelenis, Dimitrios
dc.contributor.authorMiller, Andy
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T19:13:53Z
dc.date.available2021-10-27T19:13:53Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34086
dc.sourceIIOimport
dc.titleRF characterization of mold compound materials and high-Q passives integrated using fan-out wafer-level packaging technology
dc.typeProceedings paper
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorSlabbekoorn, John
dc.contributor.imecauthorVelenis, Dimitrios
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceEPTC
dc.source.conferencedate4/12/2019
dc.source.conferencelocationSingapore Singapore
dc.identifier.urlhttps://www.conftool.net/eptc2019/index.php?page=browseSessions&print=yes&doprint=yes&form_session=166
imec.availabilityPublished - imec


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