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dc.contributor.authorThiam, Arame
dc.contributor.authorWan, Danny
dc.contributor.authorSouriau, Laurent
dc.contributor.authorBabaei Gavan, Khashayar
dc.contributor.authorRassoul, Nouredine
dc.contributor.authorSwerts, Johan
dc.contributor.authorCouet, Sebastien
dc.contributor.authorRaymenants, Eline
dc.contributor.authorJussot, Julien
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorErcken, Monique
dc.contributor.authorWilson, Chris
dc.contributor.authorRadu, Iuliana
dc.date.accessioned2021-10-27T19:35:05Z
dc.date.available2021-10-27T19:35:05Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34116
dc.sourceIIOimport
dc.titlePatterning challenges for beyond 3nm logic devices: Example of an interconnected magnetic tunnel junction
dc.typeProceedings paper
dc.contributor.imecauthorThiam, Arame
dc.contributor.imecauthorWan, Danny
dc.contributor.imecauthorSouriau, Laurent
dc.contributor.imecauthorBabaei Gavan, Khashayar
dc.contributor.imecauthorRassoul, Nouredine
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorCouet, Sebastien
dc.contributor.imecauthorRaymenants, Eline
dc.contributor.imecauthorJussot, Julien
dc.contributor.imecauthorTrivkovic, Darko
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorRadu, Iuliana
dc.contributor.orcidimecWan, Danny::0000-0003-4847-3184
dc.contributor.orcidimecSouriau, Laurent::0000-0002-5138-5938
dc.contributor.orcidimecRassoul, Nouredine::0000-0001-9489-3396
dc.contributor.orcidimecCouet, Sebastien::0000-0001-6436-9593
dc.contributor.orcidimecJussot, Julien::0000-0002-2484-3462
dc.contributor.orcidimecRadu, Iuliana::0000-0002-7230-7218
dc.source.peerreviewyes
dc.source.beginpage109580Y
dc.source.conferenceNovel Patterning Technologies for Semiconductors, MEMS/NEMS, and MOEMS 2019
dc.source.conferencedate24/02/2019
dc.source.conferencelocationSan Jose, CA USA
dc.identifier.urlhttps://doi.org/10.1117/12.2515086
imec.availabilityPublished - imec
imec.internalnotesProceedings of SPIE; Vol. 10958


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