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A highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems

dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorDe Vos, Joeri
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorMuga, Karthik
dc.contributor.authorStucchi, Michele
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-27T21:03:56Z
dc.date.available2021-10-27T21:03:56Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34244
dc.sourceIIOimport
dc.titleA highly reliable 1.4μm pitch via-last TSV module for wafer-to-wafer hybrid bonded 3D-SOC systems
dc.typeProceedings paper
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorMuga, Karthik
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecEl-Mekki, Zaid::0000-0002-9851-9139
dc.contributor.orcidimecMuga, Karthik::0000-0001-9064-4907
dc.contributor.orcidimecMiller, Andy::0000-0001-7048-2242
dc.source.peerreviewyes
dc.source.beginpage1035
dc.source.endpage1040
dc.source.conference2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8811243
imec.availabilityPublished - imec


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