Authors

Vandooren, Anne; Franco, Jacopo; Wu, Zhicheng; Parvais, Bertrand; Besnard, Guillaume; Schwarzenbach, Walter; Radu, Ionut; Nguyen, Bich-Yen; Collaert, Nadine

Conference

Extended Abstracts of the International Conference on Solid State Devices and Materials - SSDM

Title

Recent progress in sequential 3D device stacking: low temperature reliable top tier junction-less devices on 300mm wafers

Publication type

Proceedings paper

Embargo date

9999-12-31