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Recent progress in sequential 3D device stacking: low temperature reliable top tier junction-less devices on 300mm wafers

dc.contributor.authorVandooren, Anne
dc.contributor.authorFranco, Jacopo
dc.contributor.authorWu, Zhicheng
dc.contributor.authorParvais, Bertrand
dc.contributor.authorBesnard, Guillaume
dc.contributor.authorSchwarzenbach, Walter
dc.contributor.authorRadu, Ionut
dc.contributor.authorNguyen, Bich-Yen
dc.contributor.authorCollaert, Nadine
dc.date.accessioned2021-10-27T21:49:10Z
dc.date.available2021-10-27T21:49:10Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34308
dc.sourceIIOimport
dc.titleRecent progress in sequential 3D device stacking: low temperature reliable top tier junction-less devices on 300mm wafers
dc.typeProceedings paper
dc.contributor.imecauthorVandooren, Anne
dc.contributor.imecauthorFranco, Jacopo
dc.contributor.imecauthorWu, Zhicheng
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorBesnard, Guillaume
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.orcidimecVandooren, Anne::0000-0002-2412-0176
dc.contributor.orcidimecFranco, Jacopo::0000-0002-7382-8605
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage589
dc.source.endpage590
dc.source.conferenceExtended Abstracts of the International Conference on Solid State Devices and Materials - SSDM
dc.source.conferencedate2/09/2019
dc.source.conferencelocationNagoya Japan
imec.availabilityPublished - open access


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