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Scaled TaN barriers for Cu interconnects: reliability performance

dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorLariviere, Stephane
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-27T22:03:37Z
dc.date.available2021-10-27T22:03:37Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34328
dc.sourceIIOimport
dc.titleScaled TaN barriers for Cu interconnects: reliability performance
dc.typeProceedings paper
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewyes
dc.source.beginpage12.2
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC 2019) and Materials for Advanced Metallization Conference (MAM 2019)
dc.source.conferencedate3/06/2019
dc.source.conferencelocationBrussels belgium
dc.identifier.urlhttps://iitc-conference.org/technical-program-abstracts.html
imec.availabilityPublished - imec


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