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Three-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node

dc.contributor.authorVega Gonzalez, Victor
dc.contributor.authorWilson, Chris
dc.contributor.authorBriggs, Basoene
dc.contributor.authorDecoster, Stefan
dc.contributor.authorVersluijs, Janko
dc.contributor.authorLesniewska, Alicja
dc.contributor.authorPaolillo, Sara
dc.contributor.authorBaert, Rogier
dc.contributor.authorPuliyalil, Harinarayanan
dc.contributor.authorBekaert, Joost
dc.contributor.authorKesters, Els
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorLorant, Christophe
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorTeugels, Lieve
dc.contributor.authorHeylen, Nancy
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorvan der Veen, Marleen
dc.contributor.authorWebers, Tomas
dc.contributor.authorVats, Hemant
dc.contributor.authorRynders, Luc
dc.contributor.authorCupak, Miroslav
dc.contributor.authorLee, Jae Uk
dc.contributor.authorDrissi, Youssef
dc.contributor.authorHalipre, Luc
dc.contributor.authorCharley, Anne-Laure
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorWitters, Thomas
dc.contributor.authorVan Gompel, Sander
dc.contributor.authorKimura, Yosuke
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorCiofi, Ivan
dc.contributor.authorGupta, Anshul
dc.contributor.authorContino, Antonino
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorLariviere, Stephane
dc.contributor.authorDupas, Luc
dc.contributor.authorDe Wachter, Bart
dc.contributor.authorVancoille, Eric
dc.contributor.authorLazzarino, Frederic
dc.contributor.authorErcken, Monique
dc.contributor.authorDebacker, Peter
dc.contributor.authorKim, Ryan Ryoung han
dc.contributor.authorTrivkovic, Darko
dc.contributor.authorCroes, Kristof
dc.contributor.authorLeray, Philippe
dc.contributor.authorDillemans, Leander
dc.contributor.authorChen, Yi-Fan
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-27T22:10:53Z
dc.date.available2021-10-27T22:10:53Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34337
dc.sourceIIOimport
dc.titleThree-layer BEOL process integration with supervia and self-aligned-block options for the 3nm node
dc.typeProceedings paper
dc.contributor.imecauthorVega Gonzalez, Victor
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorBriggs, Basoene
dc.contributor.imecauthorDecoster, Stefan
dc.contributor.imecauthorVersluijs, Janko
dc.contributor.imecauthorLesniewska, Alicja
dc.contributor.imecauthorPaolillo, Sara
dc.contributor.imecauthorBaert, Rogier
dc.contributor.imecauthorPuliyalil, Harinarayanan
dc.contributor.imecauthorBekaert, Joost
dc.contributor.imecauthorKesters, Els
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorLorant, Christophe
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorvan der Veen, Marleen
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorVats, Hemant
dc.contributor.imecauthorRynders, Luc
dc.contributor.imecauthorCupak, Miroslav
dc.contributor.imecauthorLee, Jae Uk
dc.contributor.imecauthorDrissi, Youssef
dc.contributor.imecauthorHalipre, Luc
dc.contributor.imecauthorCharley, Anne-Laure
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorWitters, Thomas
dc.contributor.imecauthorVan Gompel, Sander
dc.contributor.imecauthorKimura, Yosuke
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorGupta, Anshul
dc.contributor.imecauthorContino, Antonino
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorLariviere, Stephane
dc.contributor.imecauthorDupas, Luc
dc.contributor.imecauthorDe Wachter, Bart
dc.contributor.imecauthorVancoille, Eric
dc.contributor.imecauthorLazzarino, Frederic
dc.contributor.imecauthorErcken, Monique
dc.contributor.imecauthorDebacker, Peter
dc.contributor.imecauthorKim, Ryan Ryoung han
dc.contributor.imecauthorTrivkovic, Darko
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorLeray, Philippe
dc.contributor.imecauthorDillemans, Leander
dc.contributor.imecauthorChen, Yi-Fan
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecDecoster, Stefan::0000-0003-1162-9288
dc.contributor.orcidimecLesniewska, Alicja::0000-0003-3863-065X
dc.contributor.orcidimecPuliyalil, Harinarayanan::0000-0002-9749-5307
dc.contributor.orcidimecBekaert, Joost::0000-0003-3075-3479
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecLorant, Christophe::0000-0001-7363-9348
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecvan der Veen, Marleen::0000-0002-9402-8922
dc.contributor.orcidimecLee, Jae Uk::0000-0002-9434-5055
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.contributor.orcidimecLazzarino, Frederic::0000-0001-7961-9727
dc.contributor.orcidimecDebacker, Peter::0000-0003-3825-5554
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage454
dc.source.endpage457
dc.source.conferenceIEEE International Electron Devices Meeting - IEDM
dc.source.conferencedate7/12/2019
dc.source.conferencelocationSan Francisco, CA USA
imec.availabilityPublished - open access


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