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Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages

dc.contributor.authorWei, Tiwei
dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorBaelmans, Martine
dc.date.accessioned2021-10-27T23:22:03Z
dc.date.available2021-10-27T23:22:03Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/34430
dc.sourceIIOimport
dc.titleThermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages
dc.typeProceedings paper
dc.contributor.imecauthorWei, Tiwei
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage1243
dc.source.endpage1252
dc.source.conference2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
dc.source.conferencedate28/05/2019
dc.source.conferencelocationLas Vegas, NV USA
dc.identifier.urlhttps://ieeexplore.ieee.org/abstract/document/8757402
imec.availabilityPublished - open access


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