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Integration of non-etchback low-k methy silsequioxane polymer using electron beam cure

dc.contributor.authorGao, Teng
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorWaeterloos, Joost
dc.contributor.authorVan Hove, Marleen
dc.contributor.authorMaex, Karen
dc.contributor.authorYang, Jiping
dc.contributor.authorWang, Sharon
dc.contributor.authorForester, Lynn
dc.date.accessioned2021-10-06T11:11:08Z
dc.date.available2021-10-06T11:11:08Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3458
dc.sourceIIOimport
dc.titleIntegration of non-etchback low-k methy silsequioxane polymer using electron beam cure
dc.typeProceedings paper
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage491
dc.source.endpage497
dc.source.conferenceAdvanced Metallization Conference in 1998 - AMC 1998
dc.source.conferencedate6/10/1998
dc.source.conferencelocationColorado Springs, CO USA
imec.availabilityPublished - open access


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