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Investigation of solder joint deformation under thermo-mechanical loading using DIC techniques

dc.contributor.authorEichhorst, Michael
dc.contributor.authorSeiler, B.
dc.contributor.authorScheiter, L.
dc.contributor.authorVandevelde, Bart
dc.contributor.authorLauwaert, Ralph
dc.date.accessioned2021-10-28T21:29:53Z
dc.date.available2021-10-28T21:29:53Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35086
dc.sourceIIOimport
dc.titleInvestigation of solder joint deformation under thermo-mechanical loading using DIC techniques
dc.typeProceedings paper
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewno
dc.source.conferenceEuWoRel Workshop
dc.source.conferencedate21/10/2020
dc.source.conferencelocationvirtual virtual
imec.availabilityPublished - imec


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