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Stress simulations of fins, wires and nanosheets

dc.contributor.authorEneman, Geert
dc.contributor.authorVeloso, Anabela
dc.contributor.authorFavia, Paola
dc.contributor.authorHikavyy, Andriy
dc.contributor.authorPorret, Clément
dc.contributor.authorArimura, Hiroaki
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorPourtois, Geoffrey
dc.contributor.authorLoo, Roger
dc.contributor.authorSpessot, Alessio
dc.contributor.authorMatagne, Philippe
dc.contributor.authorRyckaert, Julien
dc.contributor.authorHoriguchi, Naoto
dc.date.accessioned2021-10-28T21:34:13Z
dc.date.available2021-10-28T21:34:13Z
dc.date.issued2020-07
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35100
dc.sourceIIOimport
dc.titleStress simulations of fins, wires and nanosheets
dc.typeProceedings paper
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorFavia, Paola
dc.contributor.imecauthorHikavyy, Andriy
dc.contributor.imecauthorPorret, Clément
dc.contributor.imecauthorArimura, Hiroaki
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorPourtois, Geoffrey
dc.contributor.imecauthorLoo, Roger
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorMatagne, Philippe
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecFavia, Paola::0000-0002-1019-3497
dc.contributor.orcidimecHikavyy, Andriy::0000-0002-8201-075X
dc.contributor.orcidimecPorret, Clément::0000-0002-4561-348X
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.contributor.orcidimecPourtois, Geoffrey::0000-0003-2597-8534
dc.contributor.orcidimecLoo, Roger::0000-0003-3513-6058
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.source.peerreviewyes
dc.source.beginpage253
dc.source.endpage266
dc.source.conferenceECS-Fall - PRiME: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 9
dc.source.conferencedate4/10/2020
dc.source.conferencelocationHonolulu, HI USA
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/09805.0253ecst#
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 98, Issue 5


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