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Electrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry

dc.contributor.authorInoue, Fumihiro
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorStruyf, Herbert
dc.contributor.authorHou, Lin
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBeyne, Eric
dc.contributor.authorRadisic, Alex
dc.contributor.authorHsia, Chih-Hao
dc.contributor.authorChang, Iris
dc.contributor.authorKutner, Elisabeth
dc.contributor.authorFluegel, Alexander
dc.contributor.authorArnold, Marco
dc.date.accessioned2021-10-28T22:46:23Z
dc.date.available2021-10-28T22:46:23Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35306
dc.sourceIIOimport
dc.titleElectrochemical deposition of Sn-Cu alloys for applications in 3D stacking in microelectronics industry
dc.typeMeeting abstract
dc.contributor.imecauthorInoue, Fumihiro
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorHou, Lin
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorRadisic, Alex
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceElectrochemical Society Spring Meeting Symposium E03: Electrodeposition of Alloys, Intermetallic Compounds, and Eutectics
dc.source.conferencedate10/05/2020
dc.source.conferencelocationMontreal Canada
dc.identifier.urlhttps://iopscience.iop.org/article/10.1149/MA2020-01201235mtgabs#
imec.availabilityPublished - imec
imec.internalnotesECS Meeting Abstracts, Volume MA2020-01


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