Publication:
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
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2030 since deposited on 2021-10-29
6last month
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Acq. date: 2026-08-09
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Statistics
Views
2030 since deposited on 2021-10-29
6last month
2last week
Acq. date: 2026-08-09
Citations