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Nanoindentation methodologies for characterizing thin (porous) low dielectric constant materials and copper pads
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Acq. date: 2026-01-08
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Acq. date: 2026-01-08
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1 since deposited on 2021-10-29
Acq. date: 2026-01-08
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2048 since deposited on 2021-10-29
5last month
1last week
Acq. date: 2026-01-08
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